Specification :

Properties of DBC ceramic substrates:
Good mechanical strength; mechanically stable shape, good adhesion and corrosion resistant
Excellent electrical insulation
Very good thermal conductivity
Superb thermal cycling stability
The thermal expansion coefficient is close to that of silicon, so no interface layers are required
Good heat spreading
May be structured just like printed circuit boards or " IMS substrates"
Environmentally clean

Direct Bonded Copper

Advantages to the user:
The 0.3 mm thick copper layer permits higher current loading for the same conductor width. Assuming the same copper cross-section, the conductor needs to be only 12% of that of a normal printed circuit board
Excellent thermal conductivity provides the possibility of very close packaging of the chips. This translates into more power per unit of volume and improved reliability of systems and equipment
The high insulation voltage allows the use of thin dielectric material ( alumina) for improved thermal dissipation for high voltage applications.
DBC ceramic is the basis for the " chip-on-board" technology which represents the packaging trend for the future
DBC ceramic substrates are the base materials of the future for both the construction and the interconnection techniques of electronic circuits. Therefore DBC is used in our daily environment, such as:

Power hybrids and power control circuits
Power semiconductor modules
Smartpower building blocks
Solid state relays
High frequency switch mode power supplies ( SMPS)
Electronic heating devices
Building blocks for automobile electronics, as well as aerospace technology
The newly developed DBC technologies of the liquid cooled and the partial discharge free substrates have a great potential to expand further application fields of DBC substrates as well as high power semiconductor modules in the near future.