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CLACK CHINA LIMITED
Company Profile
| Company Contact | ||
|---|---|---|
| Name: | Mr. CLACK WU [Administrative] | |
| E-mail: | Send Message | |
| Mobile Number: | ||
| Phone Number: | ||
| Address: | ±¦°²¹¤ÒµÇø ÉîÛÚ 518000, Guangdong China | |
| Average User Review | There is no review for this company - Write a review | |
| Registration Date: | May. 24, 2023 | |
| Last Updated: | Dec. 19, 2010 | |
| Business Nature: | Trade, Service of Industrial Supplies category | |
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| Company Brief | ||
Clark, the reliability of China Limited Company engaged in the sale of test equipment and testing services. First, metal castings, rock, rubber tires and other testing: Industrial CT, computed tomography, X-ray real time imaging inspection system, X-ray machines, fluoroscopy. ( Industrial CT system precision castings computed tomography density divided by volume of distribution) Second, supplies: magnetic detection, penetration testing Particle testing: magnetic material of magnetic steel, iron, cobalt, nickel, small surface crack detection. For example, engines, bearings, pipe rapid detection of surface cracks. Penetration testing, including fluorescence and shading. Fluorescence method is the penetration of fluorescent substance containing liquid coating on the surface to be testing, infiltration of surface defects by capillary action, and then washed to the surface of the permeate, the defects in the permeate retained to carry out imaging. The typical imaging methods is to evenly spread the white powder was testing at the surface, will penetrate the fluid sucked out from the defect and extended to the surface. Then, in the dark surface with ultraviolet light irradiation, defects glows bright fluorescence. Coloring and the fluorescence is similar to but not including fluorescent material within the osmotic fluid, and his mouth, dye, so that permeate clear visible in white light or sunlight check. Third, the failure of the electronics industry equipment sales and testing services Means of microarray analysis summary ( microfocus xray, csam; DECAP) Microarray analysis methods are: 1 C-SAM ( ultrasound scan) , non-destructive inspection: 1. Lattice structure inside the material, impurity particles. Inclusion. Precipitate. 2. Internal cracks. 3. Lamination defects .4. Voids, bubbles, voids and so on. 2 Micro Focus XRay use: Semiconductor BGA, circuit boards and other internal displacement analysis; help determine air welding, Weld welding defects such as BGA XRAY: Micro-focus X-ray can pass through the plastic encapsulation material and metal parts inside the image, so , it is especially suitable for evaluation of induced stress caused by the flow deformation of the circuit test leads, lead fracture is the result of open, and lead or lead cross-compression pads in the chip or chip on the edge of the metal wiring, the performance of short-circuit . X-ray analysis also assessed the production and location of the bubble, plastic compound that is greater than 1 mm in diameter, large hole, it is easy to detect.) , Germany Feinfocus 3 SEM SEM / EDX energy dispersive X spectrometer ( analysis of material structure / defects observed, conventional micro-analysis of elemental composition, accurate measurement of component size) , Japan Electronics 4 EMMI dim light microscopy / OBIRCH impedance changes induced by laser beam test / LC liquid crystal hot spot detection ( these three are commonly used means of leakage current path analysis, looking for hot spots, LC to help probe station, oscilloscope) , 5 FIB to do some circuit changes; 6 Probe Station Probe Station / Probing Test probe, ESD / Latch-up ESD / latch-effectiveness testing ( some customers into the chip clients both before the reliability test, after the failure of some customers just the thought of taking good screen film for examination) has been referred to the most commonly used of these methods. Failure analysis is necessary before there are some samples of the process, taking die, decap ( Kaifeng, open cap) , grinding, ball to De-gold bump, to the floor, staining, and some also need the appropriate equipment machine, SEM can View die surface, SAM and X-Ray Observation of the internal situation and the layered package failure. Oh, welcome to obtain information. Friends within the four seas are a common means of clack 15989565652 15989565652@ 139.com addition to failure analysis in addition there are other means of atomic force microscopy AFM, secondary ion mass spectrometry SIMS, time of flight mass spectrometry TOF - SIMS, transmission electron microscope TEM, field emission electron microscope, field emission scanning Auger probe, X ray photoelectron spectroscopy XPS, LIV test system, X-ray microanalysis energy loss analysis system, and many other means, but these projects are not very common. FA steps: 1 generally do first visual inspection, to see if there crack, burnt mark or something, take pictures; 2 non-destructive analysis: mainly ultrasound scanning microscope ( C-SAM) - to see if no delamination, xray - to see the internal structure, and so on; 3 Electrical Measurement: The main tools, multimeter, oscilloscope, sony tek370a, now seems to be a 370b; 4-destructive analysis: Mechanical decap, decap chips Kaifeng Chemical Machine Microfocus Xray use: Semiconductor BGA, circuit boards and other internal displacement analysis; help determine air welding, Weld welding defects such as BGA. Parameters: standard test resolution of | ||
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